We produce and supply all the main types of solder paste developed all of them to get the highest performance in different types of applications.
Lead-Free
Description:
Halogen-containing and halogen-free fluxes for Lead Free Solder Alloys
Overview:
- Halogen and Halide-free solder paste
- Low silver solder paste
- Ultra-low Alpha count solder paste (wafer bumping)
Alloy Powder Types:
- BiSn42
- SnAg3.0Cu0.5
- SnAg0.3Cu0.7
Flux types:
- HF Halogen free
- HL Low Halogen content <1%
- H Halogen containing
Powder sizes (standard):
- Type 3 (20-45µm)
- Type 4 (20-38µm)
- Type 5 (15-25 µm)
- Type 6 (5-15µm)
Tin-Lead
Description:
Tin Lead Solder Pastes made from high purity metal (Tin, Lead)
Overview:
- Low melting point conventional tin-lead solder pastes
- No whisker risk
- RoHS non-compliant solution
- Sn63Pb37 with melting point 183°C
- Sn62Ag2Pb36 with melting point 179~189°C
- SnPb88Ag02 high melting point alloy (268°C-290°C)
Powder types:
- Sn62Ag2Pb36
- Sn63Pb37
- Sn10Pb88Ag02
Flux types:
- ROL1 low halide content flux
- ROL0 halogen free flux
Powder sizes (standard):
- Type 3 20-45µm
- Type 4 20-38µm
Water Soluable
Description:
Halogen-containing and halogen-free fluxes for Tin/Lead as well as Lead-Free solder alloys. Our formulations, with wild process window, have been proven to be excellent in shell life, stencil life, wetting and clean-ability.
Overview:
- Tin-Lead solder paste
- Lead-free solder paste
Alloy Powder Types:
Flux types:
Powder sizes (standard):
- Type 3 20-45µm
- Type 4 20-38µm
Low Temperature
Description:
Low Temperature Solder Paste for SMT devices
Overview:
- basic alloy Sn42Bi58 with melting point 138℃
- reduced energy consumption
- excellent printing and soldering performance
halogen free flux design
Powder types:
Flux types:
Powder sizes (standard):
- Type 3 20-45µm
- Type 4 20-38µm
