Electrónica
Pasta de soldar
We produce and supply all the main types of solder paste developed all of them to get the highest performance in different types of applications.

Lead-Free

Description:

Halogen-containing and halogen-free fluxes for Lead Free Solder Alloys

Overview:
  • Halogen and Halide-free solder paste
  • Low silver solder paste
  • Ultra-low Alpha count solder paste (wafer bumping)

Alloy Powder Types:
  • BiSn42
  • SnAg3.0Cu0.5
  • SnAg0.3Cu0.7
Flux types:
  • HF Halogen free
  • HL Low Halogen content <1%
  • H Halogen containing
Powder sizes (standard):
  • Type 3 (20-45µm)
  • Type 4 (20-38µm)
  • Type 5 (15-25 µm)
  • Type 6 (5-15µm)

Tin-Lead

Description:
Tin Lead Solder Pastes made from high purity metal (Tin, Lead)

Overview:
  • Low melting point conventional tin-lead solder pastes
  • No whisker risk
  • RoHS non-compliant solution
  • Sn63Pb37 with melting point 183°C
  • Sn62Ag2Pb36 with melting point 179~189°C
  • SnPb88Ag02 high melting point alloy (268°C-290°C)
 
Powder types:
  • Sn62Ag2Pb36
  • Sn63Pb37
  • Sn10Pb88Ag02
Flux types:
  • ROL1 low halide content flux
  • ROL0 halogen free flux
Powder sizes (standard):
  • Type 3 20-45µm
  • Type 4 20-38µm
 
Water Soluable

Description:
Halogen-containing and halogen-free fluxes for Tin/Lead as well as Lead-Free solder alloys. Our formulations, with wild process window, have been proven to be excellent in shell life, stencil life, wetting and clean-ability.

Overview:
  • Tin-Lead solder paste
  • Lead-free solder paste

Alloy Powder Types:
  • SnAg3.0Cu0.5
Flux types:
  • Water Soluble
Powder sizes (standard):
  • Type 3 20-45µm
  • Type 4 20-38µm
 
Low Temperature

Description:
Low Temperature Solder Paste for SMT devices

Overview:
  • basic alloy Sn42Bi58 with melting point 138℃
  • reduced energy consumption
  • excellent printing and soldering performance
halogen free flux design
 
Powder types:
  • Sn42Bi
Flux types:
  • Halogen Free
Powder sizes (standard):
  • Type 3 20-45µm
  • Type 4 20-38µm